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ANSYS Temperature Field

The ANSYS products for temperature fields allow temperature analyzes over several scales - from the microchip over the circuit board to the entire device. In the area of ​​thermal application, ANSYS products are used to describe the temperature behavior of components and assemblies taking into account heat conduction, convection and radiation.

Typical Applications

By adhering to a temperature corridor in electrical components (thermal management) - for example in microchips, control units, transformers, motors and generators - the service life is extended.

Temperature control - such as sensors, optical systems or measuring systems - ensures the high measuring accuracy of precision components.

By specifically designing heating and cooling processes in production plants such as blast furnaces and rolling mills or in plants for plastics processing, food production and in the chemical industry, energy costs, cycle times and product properties are optimized.

Optimization of energy consumption by simulating the temperature distribution of an aluminum electrolysis furnace Source: Hydro

Thermal management in a circuit board


Users benefit from specialized workflows for the imaging of tube currents without CFD, homogenized heat conduction models for windings of electrical drives and PCBs (printed circuit boards, circuit boards) without complex trace layout. In addition, there are library elements for frequently used components to describe, for example, fans with simple characteristics up to modeled CFD models.

The coupling of spatially distributed variables, such as losses from magnetic fields for low- and high-frequency applications or heat transfer coefficients from the CFD, forms the basis for an accurate representation of the reality. In many cases, the temperature has an influence on the properties of materials such as electrical resistance, modulus of elasticity, heat conduction, permeability and coercive force of permanent magnets (example: inductive heating → factor 1000 in the temperature-dependent permeability). With the bidirectional coupling of temperature field and electrical / mechanical / magnetic analysis, ANSYS allows a precise description of such relationships. Methods of Model Order Reduction (MOR) provide behavioral models that can efficiently represent the characteristic behavior in system considerations (Simplorer, Matlab), thus enabling the coordination of different components.

ANSYS Modules

In order to investigate the relevant phenomena effectively, the degree of detail and the work process of the temperature field analyzes can be adapted to the respective questions. The following modules help:

For the calculation of heat conduction and radiation to determine temperature distributions and heat flows:

The convection is defined by analytically derivable heat transfer boundary conditions, so that a good result quality and a high calculation speed can be achieved.

For a detailed understanding of physical processes with the aim of accurately mapping heat conduction, radiation and convection, as well as local effects such as cooling and heating systems or HVAC (heating, ventilation and air conditioning).

A specialized tool for the simulation of complete systems - from the complex semiconductor chip to the circuit boards up to the entire device: the thermal management can be optimized through library blocks with scalable detail. Data from ECAD and MCAD systems are loaded and optimized automatically depending on the selected detail level. Depending on the layer structure and the copper content, conductor paths are provided with homogenized, orthotropic material properties. Typical components such as fans, heat exchangers and housing breakdowns are assembled using intelligent building blocks.